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  2. J-B Weld - Wikipedia

    en.wikipedia.org/wiki/J-B_Weld

    J-B Weld epoxy is a two-part adhesive that can bond various surfaces and withstand high temperatures up to 500 °F (260 °C) constantly and 600 °F (316 °C) for short periods. It is water-resistant, petroleum/chemical-resistant, acid-resistant, and resists shock, vibration, and temperature fluctuations.

  3. Resorcinol glue - Wikipedia

    en.wikipedia.org/wiki/Resorcinol_glue

    Resorcinol glue, also known as resorcinol-formaldehyde, is an adhesive combination of resin and hardener that withstands long-term water immersion and has high resistance to ultraviolet light. [1] [2] The adhesive, introduced in 1943, has been popular in aircraft and boat construction. [2]

  4. Araldite - Wikipedia

    en.wikipedia.org/wiki/Araldite

    Araldite adhesive sets by the interaction of an epoxy resin with a hardener. Mixing an epoxy resin and hardener together starts a chemical reaction that produces heat – an exothermic reaction. [2] It is claimed that after curing the bond is impervious to boiling water and to all common organic solvents.

  5. Thermal adhesive - Wikipedia

    en.wikipedia.org/wiki/Thermal_adhesive

    Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. [1] It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.

  6. Thermal paste - Wikipedia

    en.wikipedia.org/wiki/Thermal_paste

    Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high ...

  7. Hot-melt adhesive - Wikipedia

    en.wikipedia.org/wiki/Hot-melt_adhesive

    Most polyester hot-melt adhesives have a high degree of crystallinity. Niche applications, together with polyamides taking less than 10% of total volume of hot-melt adhesives market. Water-dispersible amorphous polymers, modified by addition of sodium sulfonate groups for dispersability, were however developed for repulpable adhesives. [23]

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