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  2. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    The metric codes still represent the dimensions in mm, even though the imperial size codes are no longer aligned. Problematically, some manufacturers are developing metric 0201 components with dimensions of 0.25 mm × 0.125 mm (0.0098 in × 0.0049 in), [ 31 ] but the imperial 01005 name is already being used for the 0.4 mm × 0.2 mm (0.0157 in ...

  3. SMD LED - Wikipedia

    en.wikipedia.org/wiki/SMD_LED

    The light from white LED lamps and LED strip lights is usually provided by industry standard surface-mounted device LEDs (SMD LEDs). [2] Non-SMD types of LED lighting also exist, such as COB (chip on board) and MCOB (multi-COB). Surface-mounted device LED modules are described by the dimensions of the LED package. A single multicolor module may ...

  4. Surface-mount technology - Wikipedia

    en.wikipedia.org/wiki/Surface-mount_technology

    The same code marked on different packages or on devices from different manufacturers can translate to different devices. Many of these codes, used because the devices are too small to be marked with more traditional numbers used on larger packages, correlate to more familiar traditional part numbers when a correlation list is consulted.

  5. Reference designator - Wikipedia

    en.wikipedia.org/wiki/Reference_designator

    The reference designator usually consists of one or two letters followed by a number, e.g. C3, D1, R4, U15. The number is sometimes followed by a letter, indicating that components are grouped or matched with each other, e.g. R17A, R17B. The IEEE 315 standard contains a list of Class Designation Letters to use for electrical and electronic ...

  6. Light-emitting diode - Wikipedia

    en.wikipedia.org/wiki/Light-emitting_diode

    LED manufacturing involves multiple steps, including epitaxy, chip processing, chip separation, and packaging. [78] In a typical LED manufacturing process, encapsulation is performed after probing, dicing, die transfer from wafer to package, and wire bonding or flip chip mounting, [79] perhaps using indium tin oxide, a transparent electrical ...

  7. Metal electrode leadless face - Wikipedia

    en.wikipedia.org/wiki/Metal_electrode_leadless_face

    Metal electrode leadless face (MELF) is a type of leadless cylindrical electronic surface mount device package with metal end terminals. Diodes and resistors are the most common MELF devices. [1] The EN 140401-803 and JEDEC DO-213 standards describe multiple MELF components. [2]

  8. Thermal management of high-power LEDs - Wikipedia

    en.wikipedia.org/wiki/Thermal_management_of_high...

    Typical LED package including thermal management design Thermal animation of a high powered A19 sized LED light bulb, created using high resolution computational fluid dynamics (CFD) analysis software, showing temperature contoured LED heat sink and flow trajectories Thermal animation of a high power density industrial PAR 64 LED downlight heat sink design, created using high resolution CFD ...

  9. List of IEC standards - Wikipedia

    en.wikipedia.org/wiki/List_of_IEC_standards

    IEC 62090 Product package labels for electronic components using bar code and two-dimensional symbologies; IEC 62091 Low-voltage switchgear and control gear – Controllers for drivers of stationary fire pumps; IEC 62093 Balance-of-system components for photovoltaic systems – Design qualification natural environments