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Nickel electroplating is a process of depositing nickel onto a metal part. Parts to be plated must be clean and free of dirt, corrosion, and defects before plating can begin. [ 3 ] To clean and protect the part during the plating process, a combination of heat treating , cleaning, masking, pickling , and etching may be used. [ 1 ]
Black nickel plating was developed around 1905, and between the two wars, black chrome plating (first German patent 1929.GP 607, 420), which saw wider use only from the mid-1950s. [14] After the First World War, the first procedures for anodic oxidation and coloring of anodically oxidized aluminium were developed (1923, 1924.DRP. 413876).
Electroless nickel-boron plating developed as a variant of the similar nickel-phosphorus process, discovered accidentally by Charles Adolphe Wurtz in 1844. [2]In 1969, Harold Edward Bellis from DuPont filed a patent for a general class of electroless plating processes using sodium borohydride, dimethylamine borane, or sodium hypophosphite, in the presence of thallium salts, thus producing a ...
Electroless nickel plating also can produce coatings that are free of built-in mechanical stress, or even have compressive stress. [16] A disadvantage is the higher cost of the chemicals, which are consumed in proportion to the mass of nickel deposited; whereas in electroplating the nickel ions are replenished by the metallic nickel anode.
Chemical coloring of metals is the process of changing the color of metal surfaces with different chemical solutions. The chemical coloring of metals can be split into three types: electroplating – coating the metal surface with another metal using electrolysis. patination – chemically reacting the metal surface to form a colored oxide or ...
Nickel plating may refer to: Nickel electroplating , a technique of electroplating a thin layer of nickel onto a metal object Electroless nickel-phosphorus plating , an auto-catalytic chemical technique used to deposit a layer of nickel-phosphorus on a solid workpiece
Electroless deposition is advantageous in comparison to PVD, CVD, and electroplating deposition methods because it can be performed at ambient conditions. [2] [6] The plating method for Ni-P, Ni-Au, Ni-B, and Cu baths are distinct; however, the processes involve the same approach. The electroless deposition process is defined by four steps: [2 ...
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.