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In fact, progress in computer technology (and the continuation of Moore's Law) is becoming increasingly dependent on faster data transfer between and within microchips. [34] Optical interconnects may provide a way forward, and silicon photonics may prove particularly useful, once integrated on the standard silicon chips.
However, these specifications do not include details on the data link layer. In March 2008, SMSC (formerly OASIS SiliconSystems), inventor of the first MOST NIC, and Harman/Becker announced that they would open and license their proprietary data link layer intellectual property to other semiconductor companies on a royalty-bearing basis.
High Bandwidth Memory (HBM) is a computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM) initially from Samsung, AMD and SK Hynix.It is used in conjunction with high-performance graphics accelerators, network devices, high-performance datacenter AI ASICs, as on-package cache in CPUs [1] and on-package RAM in upcoming CPUs, and FPGAs and in some supercomputers ...
In a semiconductor memory chip, each bit of binary data is stored in a tiny circuit called a memory cell consisting of one to several transistors. The memory cells are laid out in rectangular arrays on the surface of the chip. The 1-bit memory cells are grouped in small units called words which are accessed together as a single memory address.
A Queued Serial Peripheral Interface (QSPI; different to but has same abbreviation as Quad SPI described in § Quad SPI) is a type of SPI controller that uses a data queue to transfer data across an SPI bus. [19] It has a wrap-around mode allowing continuous transfers to and from the queue with only intermittent attention from the CPU.
Image source: The Motley Fool. Taiwan Semiconductor Manufacturing (NYSE: TSM) Q4 2024 Earnings Call Jan 16, 2025, 1:00 a.m. ET. Contents: Prepared Remarks. Questions and Answers
More specifically, the global semiconductor industry's revenue was down 11% in 2024 as demand remained weak for smartphones, personal computers, and data centers.
In February 2013, semiconductor company Toshiba Memory (now Kioxia) started shipping samples of a 64 GB NAND flash chip, the first chip to support the then new UFS standard. [20] In April 2015, Samsung's Galaxy S6 family was the first phone to ship with eUFS storage using the UFS 2.0 standard. [21]