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Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge. Product ...
Battery cases; Cases with protection devices; Holsters are commonly used as third-party cases for devices, and/or are made of plastic and without exposed rigid corners. Heavy duty cases are designed to protect from drops and scratches. A standing (or kickstand) case keeps the device standing upright.
TO-92: Plastic-encapsulated package with three leads; TO-99: Metal can package with eight radial leads; TO-100: Metal can package with ten radial leads, similar to TO-99; TO-126: Plastic-encapsulated package with three leads and a hole for mounting on a heat sink; TO-220: Through-hole plastic package with a (usually) metal heat sink tab and ...
He was the primary designer of the Apple II, introduced in 1977, known as one of the first highly successful mass-produced microcomputers, [6] while Jobs oversaw the development of its foam-molded plastic case and early Apple employee Rod Holt developed its switching power supply.
Many devices are molded out of an epoxy plastic that provides adequate protection of the semiconductor devices, and mechanical strength to support the leads and handling of the package. The plastic can be cresol - novolaks , siloxane polyimide, polyxylylene, silicones, polyepoxides and bisbenzocyclo-butene. [ 4 ]
A small transformer potted in epoxy. The surface visible on the right is formed by the potting compound that has been poured into the plastic box. In electronics, potting is the process of filling a complete electronic assembly with a solid or gelatinous compound.
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