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  2. Gold–aluminium intermetallic - Wikipedia

    en.wikipedia.org/wiki/Gold–aluminium_intermetallic

    Au 5 Al 2 's formation at the joint causes increase of electrical resistance, which can lead to electrical failure. [3] Au 5 Al 2 typically forms at 95% of Au and 5% of Al by mass, its melting point is about 575 °C, which is the lowest among the major gold-aluminum intermetallic compounds.

  3. Aluminum building wiring - Wikipedia

    en.wikipedia.org/wiki/Aluminum_building_wiring

    The use of larger gauge stranded aluminum wire (larger than #8 AWG) is fairly common in much of North America for modern residential construction. Aluminum wire is used in residential applications for lower voltage service feeders from the utility to the building. This is installed with materials and methods as specified by the local electrical ...

  4. Flux (metallurgy) - Wikipedia

    en.wikipedia.org/wiki/Flux_(metallurgy)

    Deterioration of electrical properties of printed circuit boards, as soldering temperatures are above the glass transition temperature of the board material and flux components (e.g. glycols, or chloride and bromide ions) can diffuse into its matrix; e.g. water-soluble fluxes containing polyethylene glycol were demonstrated to have such impact [10]

  5. Eddy current - Wikipedia

    en.wikipedia.org/wiki/Eddy_current

    A conductive object will experience a repulsion force. This can lift objects against gravity, though with continual power input to replace the energy dissipated by the eddy currents. An example application is separation of aluminum cans from other metals in an eddy current separator. Ferrous metals cling to the magnet, and aluminum (and other ...

  6. Electromagnetic forming - Wikipedia

    en.wikipedia.org/wiki/Electromagnetic_forming

    A pinched aluminium can, produced from a pulsed magnetic field created by rapidly discharging 2 kilojoules from a high-voltage capacitor bank into a 3-turn coil of heavy gauge wire. Electromagnetic forming ( EM forming or magneforming ) is a type of high-velocity, cold forming process for electrically conductive metals, most commonly copper and ...

  7. Diffusion bonding - Wikipedia

    en.wikipedia.org/wiki/Diffusion_bonding

    Diffusion bonding involves no liquid fusion, and often no filler metal. No weight is added to the total, and the join tends to exhibit both the strength and temperature resistance of the base metal(s). The materials endure no, or very little, plastic deformation. Very little residual stress is introduced, and there is no contamination from the ...

  8. Aluminium-conductor steel-reinforced cable - Wikipedia

    en.wikipedia.org/wiki/Aluminium-conductor_steel...

    Many electrical circuits are longer than the length of conductor which can be contained on one reel. As a result, splicing is often necessary to join conductors to provide the desired length. It is important that the splice not be the weak link. A splice (joint) must have high physical strength along with a high electrical current rating.

  9. Aluminium–silicon alloys - Wikipedia

    en.wikipedia.org/wiki/Aluminium–silicon_alloys

    Aluminum forms a eutectic with silicon, which is at 577 °C, with a Si content of 12.5% [7] or 12.6%. [8] Up to 1.65% Si can be dissolved in aluminum at this temperature. However, the solubility decreases rapidly with temperature. At 500 °C it is still 0.8% Si, at 400 °C 0.3% Si and at 250 °C only 0.05% Si.