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All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset. Includes integrated RDNA2 GPU with 2 CUs and base, boost clock speeds of 0.4 GHz, 2.2 GHz. L1 cache: 80 KB (48 KB data + 32 KB instruction) per core. L2 cache: 1 MB per core. Fabrication process: TSMC N4 FinFET (N6 FinFET for the I/O die).
It is concluded that motherboards with the Knoll Activator would be built with I/O from the processor and low-cost I/O chips. [ 19 ] Individual chipset models differ in the number of PCI Express lanes, USB ports, and SATA connectors, as well as supported technologies; the table below shows these differences.
Ryzen 5 5600 Ryzen 7 5700X 6/8 3400–3500 (4400–4600 boost) Ryzen 7 5800X3D 8 3400 (4500 boost) 96 MB January 2021: Cezanne Ryzen 3 (5300G, 5300GE, 5400U) 4 2600–4000 (4000–4200 boost) 8 MB Mobile: Socket FP6. Desktop: Socket AM4. Mobile: Dual-channel DDR4 or LPDDR4. Desktop: Dual-channel DDR4. Ryzen 5 (5600G, 5600GE, 5600U, 5600H, 5600HS) 6
AMD stated that it plans to support the AM5 socket for a number of years as it did with the AM4 socket. [10] During the Ryzen 7000 series reveal on August 29, 2022, AMD confirmed that it would support the AM5 socket until at least 2025. [11] At Computex 2024, AMD announced that this support period would then be extended through 2027. [12]
Common features of Ryzen 7000 desktop CPUs: Socket: AM5. All the CPUs support DDR5-5200 in dual-channel mode. L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. L2 cache: 1 MB per core. All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
As the first largely "ground up redesign" of the Zen CPU core since the architecture family's original release in early 2017 with Zen 1/Ryzen 1000, Zen 3 was a significant architectural improvement over its predecessors; having a very significant IPC increase of +19% over the prior Zen 2 architecture in addition to being capable of reaching higher clock speeds.