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Buffered oxide etch (BOE), also known as buffered HF or BHF, is a wet etchant used in microfabrication. It is a mixture of a buffering agent , such as ammonium fluoride NH 4 F , and hydrofluoric acid (HF).
The correct technique of enamel etching prior to placement of a composite resin restoration includes etching with 30%-50% phosphoric acid and rinsing thoroughly with water and drying with air only. In preparing a cavity for restoration with composite resin combined with an acid etch technique, all enamel cavosurface angles should be obtuse angles.
Etching tanks used to perform Piranha, hydrofluoric acid or RCA clean on 4-inch wafer batches at LAAS technological facility in Toulouse, France. Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module in fabrication, and every wafer ...
Resin sealants require a phosphoric acid solution ("etch") to create microscopic porosity into which the sealant material can flow thereby increasing retention, increasing surface area and improving the strength of the bond between the sealant and the tooth surface. [28] Etching time varies from 15 to 60 seconds, depending on the product.
All-in-one self-etch adhesive and a single component universal adhesive, used in the adhesion of direct and indirect dental restorations. Also known as a "bonderizer" bonding agents (spelled dentin bonding agents in American English) are resin materials used to make a dental composite filling material adhere to both dentin and enamel.
Provide a good marginal (bacteria-tight) seal to prevent marginal leakage; Resistant to dissolution in saliva, or other oral fluid – a primary cause of decementation is dissolution of the cement at the margins of a restoration; High strength in tension, shear and compression to resist stress at the restoration–tooth interface.
Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching . RIE uses chemically reactive plasma to remove material deposited on wafers .
Piranha solution, also known as piranha etch, is a mixture of sulfuric acid (H 2 SO 4) and hydrogen peroxide (H 2 O 2). The resulting mixture is used to clean organic residues off substrates , for example silicon wafers . [ 1 ]