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Sandpaper, also known as glasspaper or as coated abrasive, is a type of material that consists of sheets of paper or cloth with an abrasive substance glued to one face. [1] In the modern manufacture of these products, sand and glass have been replaced by other abrasives such as aluminium oxide or silicon carbide.
Lapping machine. Lapping is a machining process in which two surfaces are rubbed together with an abrasive between them, by hand movement or using a machine. Lapping often follows other subtractive processes with more aggressive material removal as a first step, such as milling and/or grinding. Lapping can take two forms.
the chemical composition of the abrasive particles (common abrasives include diamond, cubic boron nitride (CBN), chromium(III) oxide, tungsten carbide, silicon carbide and other ceramics). In synthetic stones, the grit size is related to the mesh size used to select the particles to be included in the abrasive. Sandpaper also uses a similar system.
The condition of the material at hand determines what type of abrasive will be applied. The first stage, if the material is unfinished, starts with a rough abrasive (perhaps 60 or 80 grit) and each subsequent stage uses a finer abrasive, such as 120, 180, 220/240, 320, 400 and higher grit abrasives, until the desired finish is achieved.
DISCO Corporation (株式会社ディスコ, Kabushiki-gaisha Disuko) is a Japanese precision tools maker, especially for the semiconductor production industry.. The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage ...
Silicon carbide (SiC), also known as carborundum (/ ˌ k ɑːr b ə ˈ r ʌ n d əm /), is a hard chemical compound containing silicon and carbon. A wide bandgap semiconductor , it occurs in nature as the extremely rare mineral moissanite , but has been mass-produced as a powder and crystal since 1893 for use as an abrasive .
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