Search results
Results From The WOW.Com Content Network
For a given CPU core, energy usage will scale up as its clock rate increases. Reducing the clock rate or undervolting usually reduces energy consumption; it is also possible to undervolt the microprocessor while keeping the clock rate the same. [2] New features generally require more transistors, each of which uses power.
The article also revealed that representatives of the three largest Xbox 360 resellers in the world (EB Games, GameStop, and Best Buy) claimed that the failure rate of the Xbox 360 was between 30% and 33%, and that Micromart, the largest repair shop in the United Kingdom, stopped repairing Xbox 360s because it was unable to fully repair the ...
When overheating, the temperature of the part rises above the operating temperature. Overheating can take place: if heat is produced in more than expected amount (such as in cases of short-circuits, or applying more voltage than rated), or; if heat dissipation is poor, so that normally produced waste heat does not drain away properly.
The selection of a heat sink may end up with overheating (and CPU reduced performances) or overcooling (oversized, expensive heat sink), depending if one chooses a too high or a too low case temperature Tc (respectively with a too low or too high ambient temperature Ta), or if the CPU operates with different computational loads.
The Motorola 6800 microprocessor was the first for which an undocumented assembly mnemonic HCF became widely known. The operation codes (opcodes—the portions of the machine language instructions that specify an operation to be performed) hexadecimal 9D and DD were reported and given the unofficial mnemonic HCF in a December 1977 article by Gerry Wheeler in BYTE magazine on undocumented ...
The purpose of overclocking is to increase the operating speed of a given component. [3] Normally, on modern systems, the target of overclocking is increasing the performance of a major chip or subsystem, such as the main processor or graphics controller, but other components, such as system memory or system buses (generally on the motherboard), are commonly involved.
Thermal paste is sometimes also used between the CPU die and its integrated heat spreader, though solder is sometimes used instead. When a CPU heat spreader is coupled to the die via thermal paste, performance enthusiasts such as overclockers are able to, in a process known as "delidding", [ 3 ] pry the heat spreader, or CPU "lid", from the die.
On some processors, it is possible to modify the Manufacturer ID string reported by CPUID.(EAX=0) by writing a new ID string to particular MSRs (Model-specific registers) using the WRMSR instruction. This has been used on non-Intel processors to enable features and optimizations that have been disabled in software for CPUs that don't return the ...