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Wire decking consists of wire mesh supported by metal supports and is intended to be load-bearing. The mesh is usually welded to the supports, but may be attached in other ways as well. In commercial and industrial applications, the wire mesh usually has a minimum wire gauge of 0.105 inches when round wire is used. The most common shelf size is ...
Glob-top is a variant of conformal coating used in chip-on-board assembly (COB). It consists of a drop of specially formulated epoxy [3] or resin deposited over a semiconductor chip and its wire bonds, to provide mechanical support and exclude contaminants such as fingerprint residues which could disrupt circuit operation. It is most commonly ...
Chip-on-glass (COG), a variation of COB, where a chip, typically a liquid crystal display (LCD) controller, is mounted directly on glass. Chip-on-wire (COW), a variation of COB, where a chip, typically a LED or RFID chip, is mounted directly on wire, thus making it a very thin and flexible wire.
The integrated circuit package must resist physical breakage, keep out moisture, and also provide effective heat dissipation from the chip. Moreover, for RF applications, the package is commonly required to shield electromagnetic interference, that may either degrade the circuit performance or adversely affect neighboring circuits.
Underside of an 80486 with lid removed shows die and wire bonded connections. The chip can be mounted either on the top or the bottom (the pinned side). Connections can be made either by wire bonding or through flip chip mounting. Typically, PGA packages use wire bonding when the chip is mounted on the pinned side, and flip chip construction ...
The PDS-1 electronics were built from 7400 series low-density TTL integrated circuits, with only a dozen logic gates or 4 register bits per DIP chip. Small printed circuit cards held up to 12 chips each. The shallow desk pedestal held three racks or rows of cards, with 25 cards per row, and a wire wrap backplane connecting all cards. There was ...
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