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The HP4145A semiconductor parameter analyzer introduced in 1982 was capable of a complete DC characterization of semiconductor devices and materials. [2] It consisted of four independently controlled source monitor units (the precursor to source measure units) enclosed in a mainframe.
A multitude of semiconductor device and material parameters can be derived from C–V measurements with appropriate methodologies, instrumentation, and software. This information is used throughout the semiconductor production chain, and begins with evaluating epitaxially grown crystals, including parameters such as average doping concentration ...
Wafer testing is a step performed during semiconductor device fabrication after back end of line (BEOL) and before IC packaging.. Two types of testing are typically done. Very basic wafer parametric tests (WPT) are performed at a few locations on each wafer to ensure the wafer fabrication process has been carried out successfully.
Liberty Analyzer - Analysis and validation of timing, power, noise and area data from characterization; TCAD. Victory Process - 2D/3D semiconductor process simulator; Victory Device - 2D/3D semiconductor device simulator; Virtual Wafer Fab - Emulation of wafer manufacturing to perform design-of-experiments and optimization.
Agilent Technologies was created in 1999 as a spin-off of several business units of Hewlett-Packard [12] including test & measurement, optics, instrumentation and chemical analysis, electronic components, and medical equipment product lines.
In addition to S-parameters, other representations such as Y-parameters and Z-parameters can be recorded. It later became a de facto industry-standard file format not only for circuit simulators but also for measurement equipment (e.g. vector network analyzers , or VNAs), then later still an EIA standard as part of the Input/output Buffer ...
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Technology files and design rules are essential building blocks of the integrated circuit design process. Their accuracy and robustness over process technology, its variability and the operating conditions of the IC—environmental, parasitic interactions and testing, including adverse conditions such as electro-static discharge—are critical in determining performance, yield and reliability.