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  2. Thermoelectric cooling - Wikipedia

    en.wikipedia.org/wiki/Thermoelectric_cooling

    Thermoelectric cooling uses the Peltier effect to create a heat flux at the junction of two different types of materials. A Peltier cooler, heater, or thermoelectric heat pump is a solid-state active heat pump which transfers heat from one side of the device to the other, with consumption of electrical energy, depending on the direction of the current.

  3. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    Peltier cooling plates / ˈ p ɛ l t i. eɪ / take advantage of the Peltier effect to create a heat flux between the junction of two different conductors of electricity by applying an electric current. [9] This effect is commonly used for cooling electronic components and small instruments.

  4. Thermoelectric generator - Wikipedia

    en.wikipedia.org/wiki/Thermoelectric_generator

    Harvesting that heat energy using a thermoelectric generator can increase the fuel efficiency of the car. Thermoelectric generators have been investigated to replace the alternators in cars demonstrating a 3.45% reduction in fuel consumption. [33] Projections for future improvements are up to a 10% increase in mileage for hybrid vehicles. [34]

  5. Thermoelectric effect - Wikipedia

    en.wikipedia.org/wiki/Thermoelectric_effect

    Seebeck effect in a thermopile made from iron and copper wires A thermoelectric circuit composed of materials of different Seebeck coefficients (p-doped and n-doped semiconductors), configured as a thermoelectric generator. If the load resistor at the bottom is replaced with a voltmeter, the circuit then functions as a temperature-sensing ...

  6. Thermal copper pillar bump - Wikipedia

    en.wikipedia.org/wiki/Thermal_copper_pillar_bump

    A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).

  7. Thermal management of high-power LEDs - Wikipedia

    en.wikipedia.org/wiki/Thermal_management_of_high...

    Thermoelectric materials are sandwiched between two substrates made by high thermal conductivity materials. [12] N-type and p-type thermoelectric units are connected sequentially in series as the middle layer. When a high power LED generates heat, the heat will first transfer through the top substrate to the thermoelectric units.

  8. Thermoelectric materials - Wikipedia

    en.wikipedia.org/wiki/Thermoelectric_materials

    The efficiency of a thermoelectric device for electricity generation is given by , defined as =.. The maximum efficiency of a thermoelectric device is typically described in terms of its device figure of merit where the maximum device efficiency is approximately given by [7] = + ¯ + ¯ +, where is the fixed temperature at the hot junction, is the fixed temperature at the surface being cooled ...

  9. Rework (electronics) - Wikipedia

    en.wikipedia.org/wiki/Rework_(electronics)

    Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using a new one, and heating the ...