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In message-oriented middleware solutions, fan-out is a messaging pattern used to model an information exchange that implies the delivery (or spreading) of a message to one or multiple destinations possibly in parallel, and not halting the process that executes the messaging to wait for any response to that message. [1] [2] [3]
RabbitMQ is an open-source message-broker software (sometimes called message-oriented middleware) that originally implemented the Advanced Message Queuing Protocol (AMQP) and has since been extended with a plug-in architecture to support Streaming Text Oriented Messaging Protocol (STOMP), MQ Telemetry Transport (MQTT), and other protocols.
MQTT is an ISO standard (ISO/IEC PRF 20922) [1] publish–subscribe-based messaging protocol.It works on top of the Internet protocol suite TCP/IP. It is designed for connections with remote locations where a "small code footprint" is required or the network bandwidth is limited.
In digital electronics, the fan-out is the number of gate inputs driven by the output of another single logic gate. In most designs, logic gates are connected to form more complex circuits. While no logic gate input can be fed by more than one output at a time without causing contention, it is common for one output to be connected to several ...
A fan out of 4 is the answer to the canonical problem stated as follows: Given a fixed size inverter, small in comparison to a fixed large load, minimize the delay in driving the large load. After some math, it can be shown that the minimum delay is achieved when the load is driven by a chain of N inverters, each successive inverter ~4x larger ...
Reconvergent fan-out is a technique to make VLSI logic simulation less pessimistic. Static timing analysis tries to figure out the best and worst case time estimate for each signal as they pass through an electronic device. Whenever a signal passes through a node, a bit of uncertainty must be added to the time required for the signal to transit ...
FAN algorithm is an algorithm for automatic test pattern generation (ATPG).It was invented in 1983 by Hideo Fujiwara and Takeshi Shimono at the Department of Electronic Engineering, Osaka University, Japan. [1]
Sketch of the eWLB package, the first commercialized FO-WLP technology. Fan-out wafer-level packaging (also known as wafer-level fan-out packaging, fan-out WLP, FOWL packaging, FO-WLP, FOWLP, etc.) is an integrated circuit packaging technology, and an enhancement of standard wafer-level packaging (WLP) solutions.