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The relationship between thermal conductivity and conductance is analogous to the relationship between electrical conductivity and electrical conductance. Thermal resistance is the inverse of thermal conductance. [6] It is a convenient measure to use in multicomponent design since thermal resistances are additive when occurring in series. [7]
A temperature drop is observed at the interface between the two surfaces in contact. This phenomenon is said to be a result of a thermal contact resistance existing between the contacting surfaces. Thermal contact resistance is defined as the ratio between this temperature drop and the average heat flow across the interface. [1]
The fouling resistances can be calculated for a specific heat exchanger if the average thickness and thermal conductivity of the fouling are known. The product of the average thickness and thermal conductivity will result in the fouling resistance on a specific side of the heat exchanger. [17]
The SI unit of absolute thermal resistance is kelvins per watt (K/W) or the equivalent degrees Celsius per watt (°C/W) – the two are the same since the intervals are equal: ΔT = 1 K = 1 °C. The thermal resistance of materials is of great interest to electronic engineers because most electrical components generate heat and need to be cooled.
An investigator has reported some high values for the thermal conductivity of some metal air laminates both varnished and otherwise. See Taylor, T.S., Elec. World Vol 76 (24), 1159–62, 1920 in TPRC Data Series Vol 2, pp 1037–9.
The Biot number is the ratio of the thermal resistance for conduction inside a body to the resistance for convection at the surface of the body. This ratio indicates whether the temperature inside a body varies significantly in space when the body is heated or cooled over time by a heat flux at its surface.
Interfacial thermal resistance is a measure of an interface's resistance to thermal flow. This thermal resistance differs from contact resistance, as it exists even at atomically perfect interfaces. Understanding the thermal resistance at the interface between two materials is of primary significance in the study of its thermal properties.
Measurements of thermal conductivity are also subject to contact resistance, with particular significance in heat transport through granular media. Similarly, a drop in hydrostatic pressure (analogous to electrical voltage ) occurs when fluid flow transitions from one channel to another.