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J-B Kwik is a faster-curing two-part epoxy with medium-temperature resistance up to 300 °F (149 °C). Although not as strong or heat-resistant as J-B Weld, it has the same adhesion and does not shrink when hardening.
An intermediate case involves a mixture of resin and additives that requires external stimulus (light, heat, radiation) to induce curing. The curing methodology depends on the resin and the application. Particular attention is paid to the shrinkage induced by the curing. Usually small values of shrinkage (2–3%) are desirable. [2]
In between adhesive application, assembly and curing, the product can be held for a period of time, without sacrificing performance. Attempts to use traditional epoxies in IC packaging often created expensive production bottlenecks, because, as soon as the epoxy adhesive was applied, the components had to be assembled and cured immediately. B ...
Curing of epoxy resins is an exothermic reaction and in some cases produces sufficient heat to cause thermal degradation if not controlled. [28] Curing does induce residual stress in epoxy systems which have been studied. [29] The induced stresses may be alleviated with flexibilisers.
3,4-Epoxycyclohexylmethyl-3',4'-epoxycyclohexane carboxylate (ECC) is a cycloaliphatic epoxy resin which is used in many industrial applications. It reacts by cationic polymerization using thermolatent photoinitiators to form crosslinked insoluble thermosets.
The curing process is by condensation and a typical figure for Redux Liquid 775/Powder 775 is 30 minutes at 293 °F (145 °C) under a pressure of 100 psi (690 kPa). This is not critical and variations in curing-time and/or temperature may be used to increase shear and creep strength at temperatures above 140 °F (60 °C).