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These sensors, after being calibrated at the factory, are able to provide digital data concerning processor temperature information. The PECI bus , allowing access to this data from chipset components, is a proprietary single-wire interface with a variable data transfer speed (from 2 kbit/s to 2 Mbit/s).
Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets , graphics cards ...
Full-tower computer cases may contain multiple cooling fans. At the top of the case is a fan controller. Fan control is the management of the rotational speed of an electric fan. In computers, various types of computer fans are used to provide adequate cooling, and different fan control mechanisms balance their cooling capacities and noise they ...
Hence, once we know the thermal power to be dissipated (Pd), the maximum allowed case temperature (Tc) of the CPU and the maximum expected ambient temperature (Ta) of the air entering the cooling fans, we can determine the fundamental characteristics of the required Heat sink, i.e. its thermal resistance Rca, as:
Some ATX tower cases have one or more additional vents and mounting points in the left side panel where one or more fans may be installed to blow cool air directly onto the motherboard components and expansion cards, which are among the largest heat sources. Standard axial case fans are 40, 60, 80, 92, 120, 140, 200 and 220 mm in width and length.
PS3 NTSC COK-001 motherboard (60 GB version) PS3 PAL COK-002 motherboard. The PS3 received several component revisions which served to reduce power consumption. This in turn resulted in production savings, lower heat production, lower cooling requirements and quieter operation. Since launch, the Cell processor shrank from 90 nm to 45 nm. The ...
Thermal resistance is defined as temperature rise per unit of power, analogous to electrical resistance, and is expressed in units of degrees Celsius per watt (°C/W). If the device dissipation in watts is known, and the total thermal resistance is calculated, the temperature rise of the die over the ambient air can be calculated.
Heat sinks function by efficiently transferring thermal energy ("heat") from an object at high temperature to a second object at a lower temperature with a much greater heat capacity. This rapid transfer of thermal energy quickly brings the first object into thermal equilibrium with the second, lowering the temperature of the first object ...