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CPU heat sink with fan attached A heat sink (aluminium) incorporating a heat pipe (copper) All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. [1]
Heat sinks are devices that are used to extend the surface area of electronic components available for air cooling, helping to lower the components case temperature. Fans are used to increase the air flow. Thermal design and analysis is performed using hand calculations or spreadsheets, based on design rules or heat transfer correlations.
Water-cooling radiator transfers a lot of heat, and radiator fans have large static pressure (opposed to case fans that have high airflow) for dissipating heat. Laptop computers lack large openings in the case for warm air to escape. The laptop may be placed on a cooler – somewhat like a tray with fans built in – to ensure adequate cooling.
A cooling system can do this using an active cooling method (e.g. conduction coupled with forced convection) such as a heat sink with a fan, or any of the two passive cooling methods: thermal radiation or conduction. Typically, a combination of these methods is used.
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan. Vertical aluminium ...
This final case temperature is a function of the thermal resistance between the device's case and the heat-sink; and the heat-sink and the ambient (this includes the heat-sinks temp/watt rating - with lower values implying better cooling characteristics).
In such arrangement, the heat source is cooled under the thick plate instead of being cooled in direct contact with the cooling fluid. It is shown [citation needed] that the thick plate can significantly improve the heat transfer between the heat source and the cooling fluid by conducting the heat current in an optimal manner. The two most ...
Cooling capacity is the measure of a cooling system's ability to remove heat. [1] It is equivalent to the heat supplied to the evaporator/boiler part of the refrigeration cycle and may be called the "rate of refrigeration" or "refrigeration capacity".