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A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
Hence, once we know the thermal power to be dissipated (Pd), the maximum allowed case temperature (Tc) of the CPU and the maximum expected ambient temperature (Ta) of the air entering the cooling fans, we can determine the fundamental characteristics of the required Heat sink, i.e. its thermal resistance Rca, as:
The inlet air temperature relates strongly with the heat-sink base temperature. For example, if there is recirculation of air in a product, the inlet air temperature is not the ambient air temperature. The inlet air temperature of the heat sink is therefore higher, which also results in a higher heat-sink base temperature.
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CPU heat sink with fan attached A heat sink (aluminium) incorporating a heat pipe (copper) All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. [1]
Processor power dissipation or processing unit power dissipation is the process in which computer processors consume electrical energy, and dissipate this energy in the form of heat due to the resistance in the electronic circuits.
CPU fan Thermalright Le Grand Macho RT functioning Used to cool the CPU (central processing unit) heatsink. Effective cooling of a concentrated heat source such as a large-scale integrated circuit requires a heatsink, which may be cooled by a fan; [ 3 ] use of a fan alone will not prevent overheating of the small chip.