Search results
Results From The WOW.Com Content Network
In between adhesive application, assembly and curing, the product can be held for a period of time, without sacrificing performance. Attempts to use traditional epoxies in IC packaging often created expensive production bottlenecks, because, as soon as the epoxy adhesive was applied, the components had to be assembled and cured immediately. B ...
The exposure time is a function of exposure dose and film thickness. After exposure the SU-8 needs to be baked again to complete the polymerization. This baking step is not as critical as the prebake but the rising of the temperature (again to 95 °C) needs to be slow and controlled. At this point the resist is ready to be developed.
The variation of G' and G" in time can indicate the extent of the curing reaction. [7] As shown in Figure 4, after an "induction time", G' and G" start to increase, with an abrupt change in slope. At a certain point they cross each other; afterwards, the rates of G' and G" decrease, and the moduli tend to a plateau.
Isothermal transformation diagrams (also known as time-temperature-transformation (TTT) diagrams) are plots of temperature versus time (usually on a logarithmic scale). They are generated from percentage transformation-vs time measurements, and are useful for understanding the transformations of an alloy steel at elevated temperatures.
Significant advances in understanding yellowing of epoxies were achieved by Down first in 1984 (natural dark aging) [44] and later in 1986 (high-intensity light aging). [45] Down investigated various room-temperature-cure epoxy resin adhesives suitable for use in glass conservation, testing their tendency to yellow.
Pre-preg also allows one to impregnate a bulk amount of fiber and then store it in a cooled area (below 20 °C) for an extended period of time to cure later. The process can also be time consuming in comparison to the hot injection process and the added value for pre-preg preparation is at the stage of the material supplier.
Get AOL Mail for FREE! Manage your email like never before with travel, photo & document views. Personalize your inbox with themes & tabs. You've Got Mail!
In soldering, a thermal profile is a complex set of time-temperature values for a variety of process dimensions such as slope, soak, TAL, and peak. [8] Solder paste contains a mix of metal, flux, and solvents that aid in the phase change of the paste from semi-solid, to liquid to vapor; and the metal from solid to liquid.