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B-staging is a process that utilizes heat or UV light to remove the majority of solvent from an adhesive, thereby allowing a construction to be “staged”.In between adhesive application, assembly and curing, the product can be held for a period of time, without sacrificing performance.
The exposure time is a function of exposure dose and film thickness. After exposure the SU-8 needs to be baked again to complete the polymerization. This baking step is not as critical as the prebake but the rising of the temperature (again to 95 °C) needs to be slow and controlled. At this point the resist is ready to be developed.
The variation of G' and G" in time can indicate the extent of the curing reaction. [7] As shown in Figure 4, after an "induction time", G' and G" start to increase, with an abrupt change in slope. At a certain point they cross each other; afterwards, the rates of G' and G" decrease, and the moduli tend to a plateau.
The epoxy value is defined as the number of moles of epoxy group per 100g resin. So as an example using an epoxy resin with molar mass of 382 and that has 2 moles of epoxy groups per mole of resin, the EEW = 382/2 = 191, and the epoxy value is calculated as follows: 100/191 = 0.53 (i.e. the epoxy value of the resin is 0.53). [6]
Significant advances in understanding yellowing of epoxies were achieved by Down first in 1984 (natural dark aging) [44] and later in 1986 (high-intensity light aging). [45] Down investigated various room-temperature-cure epoxy resin adhesives suitable for use in glass conservation, testing their tendency to yellow.
The test complements the measurement of glass transition temperature, as an indirect measure of the degree of cure of a composite. It is inexpensive and quick, and provides information on the cure throughout a part. [1]
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The cure package is adjusted specifically for the substrate and the application. The reactive sites—cure sites—are allylic hydrogen atoms. These C-H bonds are adjacent to carbon-carbon double bonds (>C=C<). During vulcanization, some of these C-H bonds are replaced by chains of sulfur atoms that link with a cure site of another polymer ...