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Thermal conductivity is a common property targeted for maximization by creating thermal composites. In this case, the basic idea is to increase thermal conductivity by adding a highly conducting solid (such as the copper mesh or graphite [25]) into the relatively low-conducting PCM, thus increasing overall or bulk (thermal) conductivity. [26]
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).
Thermally conductive pad: As opposed to previous TIMs that come in a fluidic form, thermal pads are manufactured and used in a solid state (albeit often soft). Mostly made of silicone or silicone-like material, thermal pads have the advantage of being easy to apply. They provide thicker bond lines (ranging in thickness from larger than a few ...
Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high ...
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