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  2. RCA clean - Wikipedia

    en.wikipedia.org/wiki/RCA_clean

    The optional second step (for bare silicon wafers) is a short immersion in a 1:100 or 1:50 solution of aqueous HF (hydrofluoric acid) at 25 °C for about fifteen seconds, in order to remove the thin oxide layer and some fraction of ionic contaminants. If this step is performed without ultra high purity materials and ultra clean containers, it ...

  3. Piranha solution - Wikipedia

    en.wikipedia.org/wiki/Piranha_solution

    Molecular models of the different molecules active in Piranha solution: peroxysulfuric acid (H 2 SO 5) and hydrogen peroxide (H 2 O 2). Piranha solution, also known as piranha etch, is a mixture of sulfuric acid (H 2 SO 4) and hydrogen peroxide (H 2 O 2). The resulting mixture is used to clean organic residues off substrates, for example ...

  4. Etching (microfabrication) - Wikipedia

    en.wikipedia.org/wiki/Etching_(microfabrication)

    Etching tanks used to perform Piranha, hydrofluoric acid or RCA clean on 4-inch wafer batches at LAAS technological facility in Toulouse, France. Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module in fabrication, and every wafer ...

  5. Semiconductor device fabrication - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_device...

    Cleaning by solvents such as acetone, trichloroethylene or ultrapure water sometimes while spinning the wafer; Piranha solution; RCA clean; Wafer scrubbing; Spin cleaning [119] Jet spray cleaning [119] Cryogenic aerosol [120] Megasonics [121] Immersion batch cleaning [122] Surface passivation; Photolithography. Photoresist coating (often as a ...

  6. Ultra-high-purity steam for oxidation and annealing - Wikipedia

    en.wikipedia.org/wiki/Ultra-high-purity_steam...

    Water vapor is a key ingredient in the wet oxidation recipe. During a typical process, a furnace containing multiple wafers is flooded with water vapor. The oxygen in the water molecule reacts within the silicon wafer to form silicon dioxide. This is a sacrificial process, where the original substrate is reduced as the oxide forms on its surface.

  7. Hexafluorosilicic acid - Wikipedia

    en.wikipedia.org/wiki/Hexafluorosilicic_acid

    Thus, for example, hexafluorosilicic acid pure or in oleum solution evolves silicon tetrafluoride until the residual hydrogen fluoride re-establishes equilibrium: [7] H 2 SiF 6 ⇌ 2 HF(l) + SiF 4 (g) In alkaline-to-neutral aqueous solutions, hexafluorosilicic acid readily hydrolyzes to fluoride anions and amorphous, hydrated silica ("SiO 2 ").

  8. Why are our cleaning products failing us? Experts explain the ...

    www.aol.com/lifestyle/why-cleaning-products...

    This is the same bacteria that prompted a recall of the Laundress cleaning products in November. The company noted that an internal investigation found "the potential presence of elevated levels ...

  9. Silanization of silicon and mica - Wikipedia

    en.wikipedia.org/wiki/Silanization_of_silicon...

    Piranha solution in particular constitutes quite a harsh treatment that can potentially damage the integrity of the silicon surface. Finlayson-Pitts et al. investigated the effect of certain treatments on silicon and concluded that both the roughness (3-5 Å) and the presence of scattered large particles were preserved after 1 cycle of plasma ...