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For low-temperature soldering of heat-sensitive parts, and for soldering in the vicinity of already soldered joints without their remelting. Sn 43 Pb 43 Bi 14: 144: 163 [11] Pb: No: Bi14. Good fatigue resistance combined with low melting point. Contains phases of tin and lead-bismuth. [13] Useful for step soldering. Sn 46 Pb 46 Bi 8: 120: 167 ...
Readily dissolves silver, gold and to less but still significant extent many other metals, e.g. copper; this is a particular concern for tin-rich alloys with higher melting points and reflow temperatures. Zinc lowers the melting point and is low-cost. However, it is highly susceptible to corrosion and oxidation in air, therefore zinc-containing ...
Fusible alloys are typically made from low melting metals. There are 14 low melting metallic elements that are stable for practical handling. These are in 2 distinct groups: The 5 alkali metals have 1 s electron and melt between +181 (Li) and +28 (Cs) Celsius; The 9 poor metals have 10 d electrons and from none (Zn, Cd, Hg) to three (Bi) p electrons, they melt between -38 (Hg) and +419 (Zn ...
Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [ 1 ] as it is near eutectic , with adequate thermal fatigue properties, strength, and wettability. [ 2 ]
The solder is usually described as easy, medium, or hard in reference to its melting temperature, not the strength of the joint. Extra-easy solder contains 56% silver and has a melting point of 618 °C (1,145 °F). Extra-hard solder has 80% silver and melts at 740 °C (1,370 °F).
BAg-7, AG 102, L-Ag55Sn, Ag 1, AMS 4763, Braze 560, Silvaloy A56T, Matti-sil 56Sn, BrazeTec 5600, Silver Braze 56. Low-melting. Excellent for general purpose brazing of close-tolerance joints. Lowest melting point cadmium-free silver alloy. Low zinc content minimizes issues with prolonged or repeated heating. Slight tendency to liquate. Used in ...