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Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.
Thermal compound is commonly used to enhance the thermal conductivity from the CPU, GPU, or any heat-producing components to the heatsink cooler. (Counterclockwise from top left: Arctic MX-2, Arctic MX-4, Tuniq TX-4, Antec Formula 7, Noctua NT-H1).
The company claims that AS-5's thermal conductivity is 8.7 W/(m·K). However, a study led by the US National Renewable Energy Laboratory found that it was only 0.94 W/(m·K). [4] The study lauded Shin-Etsu X-23-7762-S and Dow Corning TC-5022 for their better thermal performance. The company also claims that its greases will never dry out or set ...
The MX4 Pro further extends this button by a fingerprint sensor called mTouch. The MX4 Pro was the first Meizu phone to implement these two technologies. The MX4 Pro features a 5.5-inch multi-touch capacitive touchscreen display with a 2K resolution of 1536 by 2560 pixels. The pixel density of the display is 546 ppi.
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).
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