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The pad and wafer are pressed together by a dynamic polishing head and held in place by a plastic retaining ring. The dynamic polishing head is rotated with different axes of rotation (i.e., not concentric). This removes material and tends to even out any irregular topography, making the wafer flat or planar. This may be necessary to set up the ...
Etching is a critically important process module in fabrication, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which resists etching. In some cases, the masking material is a photoresist which has been patterned using photolithography.
Chemical-mechanical polishing, which is used in semiconductor fabrication; Fabrication and testing of optical components; Flame polishing, a type of polishing used on glass and thermoplastics; Ultra-fine, abrasive paste polishing, polishing for soft or fragile work surfaces; Vapor polishing, a method of polishing plastics to optical clarity
The plant's major product was bottles. [21] Raw materials for the glass were continuously fed into the furnace, and the melting was continuous. The glass made using this methodology could be only one color. [38] Natural gas for melting glass: Natural gas began being used in the United States to melt glass batch during the early 1880s. [39]
In metallography and metallurgy, polishing is used to create a flat, defect-free surface for examination of a metal's microstructure under a microscope. Silicon-based polishing pads or a diamond solution can be used in the polishing process. Polishing stainless steel can also increase its sanitary benefits.
Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers' diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS ...