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Plastic small-outline no-lead package: QSOP: Quarter-size small-outline package: The terminal pitch is 0.635 mm. [3] SOIC: Small-outline integrated circuit: Also known as SOIC NARROW and SOIC WIDE: SOJ: Small-outline J-leaded package SON Small-outline no-lead package SSOP: Shrink small-outline package [3] TSOP: Thin small-outline package [3] TSSOP
Download as PDF; Printable version; In other projects ... (SMA) package (surface mount version of 1N4007 ... is the smallest size. DO-214BA, also known as GF1 [8 ...
Zener diode for high-reliability applications in QuadroMELF package. Because of their cylindrical shape and small size, these components can roll off the workbench or circuit board before they have been soldered into place. As such, there is a joke which suggests an alternate meaning for the acronym: Most End up Lying on the Floor. They are ...
Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).
SOIC-16 A PIC microcontroller (wide SOIC-28) in a ZIF socket. A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less.
Three 1N4148 diodes in glass DO-35 axial package. The black band on the right is the cathode side. Diode schematic symbol vs cathode marking on the package. The 1N4148 is a standard silicon switching signal diode. It is one of the most popular and long-lived switching diodes because of its dependable specifications and low cost.
SOD-123 package. Small Outline Diode (SOD) is a designation for a group of semiconductor packages for surface mounted diodes. The standard includes multiple variants such as SOD-123, SOD-323, SOD-523 and SOD-923. [1] SOD-123 is the largest, SOD-923 is the smallest.
Chip carriers can be smaller than dual in-line packages and since they use all four edges of the package they can have a larger pin count. Chip carriers may be made of ceramic or plastic. Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as JEDEC. Other forms are proprietary ...