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Stress migration is a failure mechanism that often occurs in integrated circuit metallization (aluminum, copper). Voids form as result of vacancy migration driven by the hydrostatic stress gradient. Large voids may lead to open circuit or unacceptable resistance increase that impedes the IC performance.
Electromigration (red arrow) is due to the momentum transfer from the electrons moving in a wire. Electromigration is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between conducting electrons and diffusing metal atoms.
Electrochemical migration (ECM) is the dissolution and movement of metal ions in presence of electric potential, which results in the growth of dendritic structures between anode and cathode. The process is most commonly observed in printed circuit boards where it may significantly decrease the insulation between conductors.
This still-relevant classical solution provides a foundation for modern problems in contact mechanics. For example, in mechanical engineering and tribology, Hertzian contact stress is a description of the stress within mating parts. The Hertzian contact stress usually refers to the stress close to the area of contact between two spheres of ...
Feedback-controlled electromigration (FCE) is an experimental technique to investigate the phenomenon known as electromigration. By controlling the voltage applied as the conductance varies it is possible to keep the voltage at a critical level for electromigration .
In continuum mechanics, the Michell solution is a general solution to the elasticity equations in polar coordinates (,) developed by John Henry Michell in 1899. [1] The solution is such that the stress components are in the form of a Fourier series in θ {\displaystyle \theta } .
Engineering stress and engineering strain are approximations to the internal state that may be determined from the external forces and deformations of an object, provided that there is no significant change in size. When there is a significant change in size, the true stress and true strain can be derived from the instantaneous size of the object.
In fracture mechanics, the energy release rate, , is the rate at which energy is transformed as a material undergoes fracture.Mathematically, the energy release rate is expressed as the decrease in total potential energy per increase in fracture surface area, [1] [2] and is thus expressed in terms of energy per unit area.