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Stress migration is a failure mechanism that often occurs in integrated circuit metallization (aluminum, copper). Voids form as result of vacancy migration driven by the hydrostatic stress gradient. Large voids may lead to open circuit or unacceptable resistance increase that impedes the IC performance.
eFuses can be made out of silicon or metal traces. In both cases, they work (blow) by electromigration, the phenomenon where electric flow causes the conductor material to move. Although electromigration is generally undesired in chip design as it causes failures, eFuses are made of weak traces that are designed to fail before others do. [3] [4]
The model is abstract, not based on a specific physical model, but flexibly describes the failure rate dependence on the temperature, the electrical stress, and the specific technology and materials. More adequately described as descriptive than prescriptive, the values for A , n , and Q are found by fitting the model to experimental data.
Electromigration (red arrow) is due to the momentum transfer from the electrons moving in a wire. Electromigration is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between conducting electrons and diffusing metal atoms.
Feedback-controlled electromigration (FCE) is an experimental technique to investigate the phenomenon known as electromigration. By controlling the voltage applied as the conductance varies it is possible to keep the voltage at a critical level for electromigration .
Engineering stress and engineering strain are approximations to the internal state that may be determined from the external forces and deformations of an object, provided that there is no significant change in size. When there is a significant change in size, the true stress and true strain can be derived from the instantaneous size of the object.
Experimentally, stress relaxation is determined by step strain experiments, i.e. by applying a sudden one-time strain and measuring the build-up and subsequent relaxation of stress in the material (see figure), in either extensional or shear rheology. a) Applied step strain and b) induced stress as functions of time for a viscoelastic material.
A stress profile is developed and applied to the UUT. The profile simulates the environmental conditions encountered during transportation, storage, handling, and operational use phases. The UUT is configured to match the phase, e.g. transportation shocks are applied with the UUT in the shipping container, operational use temperature cycles are ...