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  2. Solderability - Wikipedia

    en.wikipedia.org/wiki/Solderability

    Both quantitative and qualitative tests for solderability exist. [6] The two most common testing methods are the 'dip and look' method and wetting balance analysis.In both of these tests, the soldered pieces undergo an accelerated aging process before being tested for solderability, to take into consideration the time a component was in storage prior to mounting to final assembly.

  3. Point-to-point construction - Wikipedia

    en.wikipedia.org/wiki/Point-to-point_construction

    The crucial invention was to apply soldering to electrical assembly. In soldering, an alloy of tin and lead (and/or other metals), known as solder, is melted and adheres to other, nonmolten metals, such as copper or tinned steel. Solder makes a strong electrical and mechanical connection.

  4. Moisture sensitivity level - Wikipedia

    en.wikipedia.org/wiki/Moisture_sensitivity_level

    Most of this damage is not visible on the component surface. In extreme cases, cracks will extend to the component surface. In the most severe cases, the component will bulge and pop. This is known as the "popcorn" effect. This occurs when part temperature rises rapidly to a high maximum during the soldering (assembly) process.

  5. Main distribution frame - Wikipedia

    en.wikipedia.org/wiki/Main_distribution_frame

    Small, single-sided MDF for a military base, 1940s Modern main distribution frame MDF at a central office with capacity for 67000 users. In telephony, a main distribution frame (MDF or main frame) is a signal distribution frame for connecting equipment (inside plant) to cables and subscriber carrier equipment (outside plant).

  6. Solder alloys - Wikipedia

    en.wikipedia.org/wiki/Solder_alloys

    Used as a solder in low-temperature physics, will bond to aluminium. Can be used for soldering to thin metal films or glass with an ultrasonic soldering iron. [2] In 75 Pb 25: 156: 165 [12] Pb: No: Less gold dissolution and more ductile than lead-tin alloys. Used for die attachment, general circuit assembly and packaging closures. [12] In 70 Pb ...

  7. Wire wrap - Wikipedia

    en.wikipedia.org/wiki/Wire_wrap

    Close-up of a wire-wrap connection Typical wire wrap construction of Bell System telephone crossbar switch.Some types of connection were soldered. Wire wrap is an electronic component assembly technique that was invented to wire telephone crossbar switches, and later adapted to construct electronic circuit boards.

  8. Potting (electronics) - Wikipedia

    en.wikipedia.org/wiki/Potting_(electronics)

    As an alternative, many circuit board assembly houses coat assemblies with a layer of transparent conformal coating rather than potting. [5] Conformal coating gives most of the benefits of potting, and is lighter and easier to inspect, test, and repair. Conformal coatings can be applied as liquid or condensed from a vapor phase.

  9. Selective soldering - Wikipedia

    en.wikipedia.org/wiki/Selective_soldering

    Selective soldering machine. Selective soldering is the process of selectively soldering components to printed circuit boards and molded modules that could be damaged by the heat of a reflow oven or wave soldering in a traditional surface-mount technology (SMT) or through-hole technology assembly processes. This usually follows an SMT oven ...