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  2. LGA 1700 - Wikipedia

    en.wikipedia.org/wiki/LGA_1700

    LGA 1700 (Socket V) is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Alder Lake and Raptor Lake, which was first released in November 2021. LGA 1700 is designed as a replacement for LGA 1200 (known as Socket H5 ) and it has 1700 protruding pins to make contact with the pads on the processor.

  3. CPU socket - Wikipedia

    en.wikipedia.org/wiki/CPU_socket

    CPUs with a PGA (pin grid array) package are inserted into the socket and, if included, the latch is closed. CPUs with an LGA (land grid array) package are inserted into the socket, the latch plate is flipped into position atop the CPU, and the lever is lowered and locked into place, pressing the CPU's contacts firmly against the socket's lands ...

  4. List of Intel Core processors - Wikipedia

    en.wikipedia.org/wiki/List_of_Intel_Core_processors

    Socket: LGA 1700. All the CPUs support dual-channel DDR4-3200 or DDR5-4800 RAM. All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets. All CPUs feature a DMI 4.0 8-lane bus to the chipset . L1 cache: P-cores: 80 KB (48 KB data + 32 KB instructions) per core.

  5. List of Intel processors - Wikipedia

    en.wikipedia.org/wiki/List_of_Intel_processors

    This generational list of Intel processors attempts to present all of Intel's processors from the ... LGA 1700 13100F — 58 89 $109 13100T 2.5 4.2 4.2 UHD 730 1.5 ...

  6. List of Intel chipsets - Wikipedia

    en.wikipedia.org/wiki/List_of_Intel_chipsets

    Chipsets supporting LGA 1156 CPUs (Lynnfield and Clarkdale). Not listed below is the 3450 chipset (see Xeon chipsets) which is compatible with Nehalem mainstream and high-end processors but does not claim core iX-compatibility. With either a Core i5 or i3 processor, the 3400-series chipsets enable the ECC functionality of unbuffered ECC memory ...

  7. Raptor Lake - Wikipedia

    en.wikipedia.org/wiki/Raptor_Lake

    The processors are connected to PCHs using an OPIO 2.0 x8 interface, except for the HX series which uses a DMI 4.0 x8 interface. [29] Except for the HX series, the processor and PCH are packaged together on a multi-chip package. The HX series uses 45x37.5mm BGA 1964, and the other mobile processors use 25x50mm BGA 1744, on a Type 3 or Type 4 HDI.