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The physical phenomena on which the device relies (such as spinning platters in a hard drive) will also impose limits; for instance, no spinning platter shipping in 2009 saturates SATA revision 2.0 (3 Gbit/s), so moving from this 3 Gbit/s interface to USB 3.0 at 4.8 Gbit/s for one spinning drive will result in no increase in realized transfer rate.
The written USB 3.0 specification was released by Intel and its partners in August 2008. The first USB 3.0 controller chips were sampled by NEC in May 2009, [4] and the first products using the USB 3.0 specification arrived in January 2010. [5] USB 3.0 connectors are generally backward compatible, but include new wiring and full-duplex operation.
In USB 3.0, dual-bus architecture is used to allow both USB 2.0 (Full Speed, Low Speed, or High Speed) and USB 3.0 (SuperSpeed) operations to take place simultaneously, thus providing backward compatibility. The structural topology is the same, consisting of a tiered star topology with a root hub at level 0 and hubs at lower levels to provide ...
USB 3.0 introduced Type-A SuperSpeed plugs and receptacles as well as micro-sized Type-B SuperSpeed plugs and receptacles. The 3.0 receptacles are backward-compatible with the corresponding pre-3.0 plugs. USB 3.x and USB 1.x Type-A plugs and receptacles are designed to interoperate. To achieve USB 3.0's SuperSpeed (and SuperSpeed+ for USB 3.1 ...
The USB-IF used WiGig Serial Extension v1.2 specification as its initial foundation for the MA-USB specification and is compliant with SuperSpeed USB (3.0 and 3.1) and Hi-Speed USB (USB 2.0). Devices that use MA-USB will be branded as "Powered by MA-USB", provided the product qualifies its certification program. [106]
USB 3.0 SuperSpeed and USB 2.0 High-Speed versions defined USB 3.0 SuperSpeed – host controller (xHCI) hardware support, no software overhead for out-of-order commands; USB 2.0 High-speed – enables command queuing in USB 2.0 drives; Streams were added to the USB 3.0 SuperSpeed protocol for supporting UAS out-of-order completions