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  2. MIT World Peace University - Wikipedia

    en.wikipedia.org/wiki/MIT_World_Peace_University

    MIT World Peace University,(MIT-WPU) is a private university located in Kothrud, Pune, India. [8] [9] It is a part of the MIT Group of Institutions. [10] [11] It is officially named Dr. Vishwanath Karad MIT World Peace University. It was established under the Government of Maharashtra Act No. XXXV 2017 and recognized by the University Grants ...

  3. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Bare silicon chip, an early chip-scale package CSP: Chip-scale package: Package size is no more than 1.2× the size of the silicon chip [16] [17] TCSP: True chip-size package: Package is same size as silicon [18] TDSP: True die-size package: Same as TCSP [18] WCSP or WL-CSP or WLCSP: Wafer-level chip-scale package

  4. Chip-scale package - Wikipedia

    en.wikipedia.org/wiki/Chip-scale_package

    In the top-right, a SOT23 package is shown for comparison. A chip scale package or chip-scale package (CSP) is a type of integrated circuit package. [1] Originally, CSP was the acronym for chip-size packaging. Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging.

  5. MIT Robocon Tech Team - Wikipedia

    en.wikipedia.org/wiki/MIT_Robocon_Tech_Team

    MIT Tech team at Robocon India 2008. It was founded in 2007 by MIT-Pune, now MIT-WPU. The team was established under the guidance of Prof. Ms. S.H. Kulkarni, Prof. Dr. Saket Yeolekar, and Prof. Dr. Vishwanath Karad, who also played a crucial role in mentoring the team.

  6. MIT Group of Institutions - Wikipedia

    en.wikipedia.org/wiki/MIT_Group_of_Institutions

    The MIT Group of Institutions is a nonprofit group of educational institutions operated by the Maharashtra Academy of Engineering and Educational Research. It is unrelated to Massachusetts Institute of Technology ( MIT ) located in the United States.

  7. Wafer-level packaging - Wikipedia

    en.wikipedia.org/wiki/Wafer-level_packaging

    WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die. Wafer-level packaging allows integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment.

  8. Semiconductor package - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_package

    A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits.

  9. Department of Electrical Engineering and Computer Science at MIT

    en.wikipedia.org/wiki/Department_of_Electrical...

    The Department of Electrical Engineering and Computer Science at MIT [1] is an engineering department of the Massachusetts Institute of Technology in Cambridge, Massachusetts.It offers degrees of Master of Science, Master of Engineering, Doctor of Philosophy, and Doctor of Science.