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  2. Adhesive bonding of semiconductor wafers - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding_of...

    Adhesive bonding with organic materials such as BCB or SU-8 has simple process properties and the ability to form high-aspect ratio micro structures. The bonding procedure is based on polymerization reaction of organic molecules to form long polymer chains during annealing. This cross-link reaction forms BCB and SU-8 to a solid polymer layer. [3]

  3. Adhesive bonding - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding

    Adhesive bonding is a joining technique used in the manufacture and repair of a wide range of products. Along with welding and soldering, adhesive bonding is one of the basic joining processes. In this technique, components are bonded together using adhesives. The broad range of types of adhesives available allows numerous materials to be ...

  4. Chemistry of pressure-sensitive adhesives - Wikipedia

    en.wikipedia.org/wiki/Chemistry_of_pressure...

    The wear of an adhesive tape as it slides across a substrate can be estimated using Archard's Law of Adhesive Wear, where and are the hardness and wear coefficients of the adhesive tape, is the distance the adhesive is dragged across the substrate surface, is the total normal load acting on the adhesive tape, and is the volume of the adhesive ...

  5. Green strength - Wikipedia

    en.wikipedia.org/wiki/Green_strength

    A joint made through the use of an adhesive can be referred to as an adhesive joint or bond. Phases of Epoxy. The green strength of adhesives is the early development of bond strength of an adhesive. It indicated "that the adhesive bond is strong enough to be handled a short time after the adherents are mated but much before full cure is obtained."

  6. Direct bonding - Wikipedia

    en.wikipedia.org/wiki/Direct_bonding

    The procedural steps of the direct bonding process of wafers any surface is divided into wafer preprocessing, pre-bonding at room temperature and; annealing at elevated temperatures. Even though direct bonding as a wafer bonding technique is able to process nearly all materials, silicon is the most established material up to now. Therefore, the ...

  7. Carbotanium - Wikipedia

    en.wikipedia.org/wiki/Carbotanium

    The components of carbotanium; carbon fiber and titanium, are woven together to form a strong, light material that can withstand significant amounts of heat and strain. This is because carbon fiber has the highest strength-to-density ratio of any current fiber and titanium has the highest strength-to-density ratio of any current metal.

  8. Adhesive bonding in structural steel applications - Wikipedia

    en.wikipedia.org/wiki/Use_of_adhesives_in...

    Adhesive bonding is a process by which two members of equal or dissimilar composition are joined. It is used in place of, or to complement other joining methods such mechanical fasting by the use nails, rivets, screws or bolts and many welding processes. [ 1 ]

  9. Solvent bonding - Wikipedia

    en.wikipedia.org/wiki/Solvent_bonding

    Solvent bonding differs from adhesive bonding, because the solvent does not become a permanent addition to the joined substrate. [4] Solvent bonding differs from other plastic welding processes in that heating energy is generated by the chemical reaction between the solvent and thermoplastic, and cooling occurs during evaporation of the solvent ...