When.com Web Search

Search results

  1. Results From The WOW.Com Content Network
  2. Adhesive bonding of semiconductor wafers - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding_of...

    Adhesive bonding with organic materials such as BCB or SU-8 has simple process properties and the ability to form high-aspect ratio micro structures. The bonding procedure is based on polymerization reaction of organic molecules to form long polymer chains during annealing. This cross-link reaction forms BCB and SU-8 to a solid polymer layer. [3]

  3. Wafer bond characterization - Wikipedia

    en.wikipedia.org/wiki/Wafer_bond_characterization

    [1] The bond strength can be evaluated using double cantilever beam or chevron respectively micro-chevron tests. Other pull tests as well as burst, direct shear tests or bend tests enable the determination of the bond strength. [2] The packaging hermeticity is characterized using membrane, He-leak, resonator/pressure tests. [1]

  4. Adhesive bonding - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding

    Adhesive bonding is a joining technique used in the manufacture and repair of a wide range of products. Along with welding and soldering, adhesive bonding is one of the basic joining processes. In this technique, components are bonded together using adhesives. The broad range of types of adhesives available allows numerous materials to be ...

  5. Dispersive adhesion - Wikipedia

    en.wikipedia.org/wiki/Dispersive_adhesion

    Sometimes grouped into the chemical mechanism of adhesion, hydrogen bonding can increase adhesive strength by the dispersive mechanism. [3] Hydrogen bonding occurs between molecules with a hydrogen atom attached to a small, electronegative atom such as fluorine , oxygen or nitrogen .

  6. Direct bonding - Wikipedia

    en.wikipedia.org/wiki/Direct_bonding

    Direct bonding, or fusion bonding, is a wafer bonding process without any additional intermediate layers. It is based on chemical bonds between two surfaces of any material possible meeting numerous requirements. [1] These requirements are specified for the wafer surface as sufficiently clean, flat and smooth.

  7. Carbotanium - Wikipedia

    en.wikipedia.org/wiki/Carbotanium

    It is a combination of beta titanium alloy with advanced carbon composites, having a matched yield strength and moduli of elasticity ratio. When the combination is adhesively bonded, both parts will approach maximum yield strength and fail at a similar amount of total strain. [ 1 ]

  8. Adhesive - Wikipedia

    en.wikipedia.org/wiki/Adhesive

    The bond forms because the adhesive is soft enough to flow (i.e., "wet") to the adherend. The bond has strength because the adhesive is hard enough to resist flow when stress is applied to the bond. Once the adhesive and the adherend are in close proximity, molecular interactions, such as van der Waals forces , become involved in the bond ...

  9. Adhesive bonding in structural steel applications - Wikipedia

    en.wikipedia.org/wiki/Use_of_adhesives_in...

    Engineers that rely heavily in the AISC manual for steel construction and AWS D1.1 for guidance have found out that the word “adhesive” appears only three times in the 604-page long AWS D1.1/D1.1M:2015 Structural Welding Code – Steel and only as part of the title of a reference standard (AWS A3.0, Standard Welding Terms and Definitions ...