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The pad and wafer are pressed together by a dynamic polishing head and held in place by a plastic retaining ring. The dynamic polishing head is rotated with different axes of rotation (i.e., not concentric). This removes material and tends to even out any irregular topography, making the wafer flat or planar. This may be necessary to set up the ...
Etching is a critically important process module in fabrication, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which resists etching. In some cases, the masking material is a photoresist which has been patterned using photolithography.
Anodic bonding on silicon substrates is divided into bonding using a thin sheet of glass (a wafer) or a glass layer that is deposited onto the silicon using a technique such as sputtering. The glass wafer is often sodium-containing Borofloat or Pyrex glasses. With an intermediate glass layer, it is also possible to connect two silicon wafers. [6]
In 1999, researchers at the Optical Processing Center of the University of Rochester studied the mechanical and chemical principles of magnetorheological polishing, determined the removal relationship of a series of non-magnetic polishing powders of different hardness on optical glass of different hardness, and studied the polishing area of ...
Spin coating is widely used in microfabrication of functional oxide layers on glass or single crystal substrates using sol-gel precursors, where it can be used to create uniform thin films with nanoscale thicknesses. [6] It is used intensively in photolithography, to deposit layers of photoresist about 1 micrometre thick. Photoresist is ...
For electronic applications, semiconducting substrates such as silicon wafers can be used. For optical devices or flat panel displays, transparent substrates such as glass or quartz are common. The substrate enables easy handling of the micro device through the many fabrication steps.