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In chemistry, deposition occurs when molecules settle out of a solution. Deposition can be defined as the process of direct transition of a substance from its gaseous form, on cooling, into a solid state without passing through the intermediate liquid state. [1] Deposition can be viewed as a reverse process to dissolution or particle re ...
Deposition is the phase transition in which gas transforms into solid without passing through the liquid phase. Deposition is a thermodynamic process . The reverse of deposition is sublimation and hence sometimes deposition is called desublimation .
Particle deposition is the spontaneous attachment of particles to surfaces. The particles in question are normally colloidal particles , while the surfaces involved may be planar, curved, or may represent particles much larger in size than the depositing ones (e.g., sand grains).
Atomic layer deposition (ALD) is a thin-film deposition technique based on the sequential use of a gas-phase chemical process; it is a subclass of chemical vapour deposition. The majority of ALD reactions use two chemicals called precursors (also called "reactants"). These precursors react with the surface of a material one at a time in a ...
Deposition (chemistry), molecules settling out of a solution Deposition (geology) , material such as sediment being added to a landform Deposition (phase transition) , the process by which a gas is transformed into a solid
Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a ...
The reverse process of sublimation is deposition (also called desublimation), in which a substance passes directly from a gas to a solid phase, without passing through the liquid state. [4] Technically, all solids may sublime, though most sublime at extremely low rates that are hardly detectable under usual conditions.
Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by the phenomenon of sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. [1] [2]