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  2. Electrical conduit - Wikipedia

    en.wikipedia.org/wiki/Electrical_conduit

    4.1 Surface mounted raceway (wire molding) 4. ... The cost of conduit installation is higher than other wiring methods due to the cost of materials and labor ...

  3. Electrical discharge machining - Wikipedia

    en.wikipedia.org/wiki/Electrical_discharge_machining

    Electrical discharge machining (EDM), also known as spark machining, spark eroding, die sinking, wire burning or wire erosion, is a metal fabrication process whereby a desired shape is obtained by using electrical discharges (sparks). [1]

  4. Rule-based DFM analysis for electric discharge machining

    en.wikipedia.org/wiki/Rule-based_DFM_analysis...

    Surface finishing comprises the small local deviations of a surface from the perfectly flat ideal. It is one of the important factors that controls friction and transfer layer formation during sliding. Many wire EDM machines have adopted the pulse generating circuit using low power for ignition and high power for machining.

  5. Wire bonding - Wikipedia

    en.wikipedia.org/wiki/Wire_bonding

    Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common.

  6. Potting (electronics) - Wikipedia

    en.wikipedia.org/wiki/Potting_(electronics)

    The mold may be part of the finished article and may provide shielding or heat dissipating functions in addition to acting as a mold. When the mold is removed the potted assembly is described as cast. [4] As an alternative, many circuit board assembly houses coat assemblies with a layer of transparent conformal coating rather than potting. [5]

  7. Integrated circuit packaging - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit_packaging

    Surface mount packaging appeared in the early 1980s and became popular in the late 1980s, using finer lead pitch with leads formed as either gull-wing or J-lead, as exemplified by small-outline integrated circuit—a carrier which occupies an area about 30–50% less than an equivalent DIP, with a typical thickness that is 70% less. [6]

  8. Lead frame - Wikipedia

    en.wikipedia.org/wiki/Lead_frame

    A lead frame has two sections: a die paddle, where the die sits in the leadframe, and the leads. The leadframe is made of an alloy the molding compound can adhere to, a thermal expansion coefficient that is as close as possible to that of the die and compound, has good thermal and electrical conductivity, is strong enough and has high formability.

  9. Corona treatment - Wikipedia

    en.wikipedia.org/wiki/Corona_treatment

    All materials have an inherent surface energy. Surface treatment systems are available for virtually any surface format including dimensional objects, sheets and roll goods that are handled in a web format. Corona treatment is a widely used surface treatment method in the plastic film, extrusion, and converting industries. [1]