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  2. Furnace anneal - Wikipedia

    en.wikipedia.org/wiki/Furnace_anneal

    The damage caused can be repaired by subjecting the crystal to high temperature. This process is called annealing. Furnace anneals may be integrated into other furnace processing steps, such as oxidations, or may be processed on their own. Furnace anneals are performed by equipment especially built to heat semiconductor wafers. Furnaces are ...

  3. Annealing (materials science) - Wikipedia

    en.wikipedia.org/wiki/Annealing_(materials_science)

    For high volume process annealing, gas fired conveyor furnaces are often used. For large workpieces or high quantity parts, car-bottom furnaces are used so workers can easily move the parts in and out. Once the annealing process is successfully completed, workpieces are sometimes left in the oven so the parts cool in a controllable way.

  4. Ultra-high-purity steam for oxidation and annealing - Wikipedia

    en.wikipedia.org/wiki/Ultra-high-purity_steam...

    Annealing and passivation are techniques used to repair atomic defects within the crystal that propagate into the wafer macrostructure, reducing efficiencies in microelectronics and photovoltaic cells. High temperature annealing can increase carrier lifetimes by injecting H into the Si/SiO 2 interface.

  5. Semiconductor device fabrication - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_device...

    A recipe in semiconductor manufacturing is a list of conditions under which a wafer will be processed by a particular machine in a processing step during manufacturing. [158] Process variability is a challenge in semiconductor processing, in which wafers are not processed evenly or the quality or effectiveness of processes carried out on a ...

  6. Front end of line - Wikipedia

    en.wikipedia.org/wiki/Front_end_of_line

    Illustration of FEOL (device generation in the silicon, bottom) and BEOL (depositing metalization layers, middle part) to connect the devices. CMOS fabrication process. The front end of line (FEOL) is the first portion of IC fabrication where the individual components (transistors, capacitors, resistors, etc.) are patterned in a semiconductor substrate. [1]

  7. Microfabrication - Wikipedia

    en.wikipedia.org/wiki/Microfabrication

    Simplified illustration of the process of fabrication of a CMOS inverter on p-type substrate in semiconductor microfabrication. Each etch step is detailed in the following image. The diagrams are not to scale, as in real devices, the gate, source, and drain contacts are not normally located in the same plane. Detail of an etch step.

  8. I've cracked the code on feline love – here are the sweetest ...

    www.aol.com/ive-cracked-code-feline-love...

    Running to greet you is one of the ways our feline friends express just how much we mean to them. 4. Following you around. Person petting cat on head.

  9. Salicide - Wikipedia

    en.wikipedia.org/wiki/Salicide

    Salicide process. The salicide process begins with deposition of a thin transition metal layer over fully formed and patterned semiconductor devices (e.g. transistors).The wafer is heated, allowing the transition metal to react with exposed silicon in the active regions of the semiconductor device (e.g., source, drain, gate) forming a low-resistance transition metal silicide.