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This velocity is a characteristic of the material and a strong function of doping or impurity levels and temperature. It is one of the key material and semiconductor device properties that determine a device such as a transistor's ultimate limit of speed of response and frequency.
Velocity saturation greatly affects the voltage transfer characteristics of a field-effect transistor, which is the basic device used in most integrated circuits. If a semiconductor device enters velocity saturation, an increase in voltage applied to the device will not cause a linear increase in current as would be expected by Ohm's law ...
Generally, forced convection heat sink thermal performance is improved by increasing the thermal conductivity of the heat sink materials, increasing the surface area (usually by adding extended surfaces, such as fins or foam metal) and by increasing the overall area heat transfer coefficient (usually by increase fluid velocity, such as adding ...
Thermal velocity or thermal speed is a typical velocity of the thermal motion of particles that make up a gas, liquid, etc. Thus, indirectly, thermal velocity is a measure of temperature. Technically speaking, it is a measure of the width of the peak in the Maxwell–Boltzmann particle velocity distribution.
The term "hot electron" comes from the effective temperature term used when modelling carrier density (i.e., with a Fermi-Dirac function) and does not refer to the bulk temperature of the semiconductor (which can be physically cold, although the warmer it is, the higher the population of hot electrons it will contain all else being equal).
Here v F ≈ 10 6 m/s (0.003 c) is the Fermi velocity in graphene, which replaces the velocity of light in the Dirac theory; is the vector of the Pauli matrices; () is the two-component wave function of the electrons and E is their energy. [2]
A semiconductor is a material that is between the conductor and insulator in ability to conduct ... in which conductivity decreases with an increase in temperature. [4]
Rapid thermal processing (RTP) is a semiconductor manufacturing process which heats silicon wafers to temperatures exceeding 1,000°C for not more than a few seconds. During cooling wafer temperatures must be brought down slowly to prevent dislocations and wafer breakage due to thermal shock.