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The MIL-STD-883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within military and aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and ...
MIL-STD-810, test methods for determining the environmental effects on equipment [24] MIL-STD-882, standard practice for system safety [25] MIL-STD-883, test method standard for microcircuits [26] MIL-STD-1168, a classification system for ammunition production that replaced the Ammunition Identification Code (AIC) system used during World War II.
MIL-STD-883 methods 2011.9 destructive bond pull test [1] and 2031.1 flip chip pull off test [2] apply, as well as JEDEC JESD22-B109. Partial coring may be used, if necessary, to eliminate surface skin effects.
Method: Per Mil-Std-810G for LRUs and SRUs, per Mil-Std-202G for electronic piece parts, per Mil-Std-1540 for space systems, and per Mil-Std-883H for microelectronic devices. EMI/RFI Testing is usually included in ESS Qualification Testing and requires application of MIL-STD 461E. These Military Standards require tailoring.
The HBM definition most widely used is the test model defined in the United States military standard, MIL-STD-883, Method 3015.9, Electrostatic Discharge Sensitivity Classification. This method establishes a simplified equivalent electrical circuit and the necessary test procedures required to model an HBM ESD event.
This document outlines the general requirements of fully assembled devices, whether they are single chip, multichip, or of hybrid technology. The test procedures of these requirements are found in MIL-STD-883 (Test Methods and Procedures for Microelectronics) as a listing of test methods. These methods cover various aspects of the minimum ...
MIL-STD-810 is maintained by a Tri-Service partnership that includes the United States Air Force, Army, and Navy. [2] The U.S. Army Test and Evaluation Command, or ATEC, serves as Lead Standardization Activity / Preparing Activity, and is chartered under the Defense Standardization Program (DSP) with maintaining the functional expertise and serving as the DoD-wide technical focal point for the ...
The purpose of the test is as MIL-STD-883 2011.9 describes it: "To measure bond strengths, evaluate bond strength distributions, or determine compliance with specified bond strength requirements". A wire can be pulled to destruction, but there are also non-destructive variants whereby one tests whether the wire can withstand a certain force.