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Epoxy adhesives are better in heat and chemical resistance than other common adhesives. In general, epoxy adhesives cured with heat will be more heat- and chemical-resistant than those cured at room temperature. The strength of epoxy adhesives is degraded at temperatures above 350 °F (177 °C). [48]
Adhesives, especially SU-8 and benzocyclobutene (BCB), are specialized for production of MEMS and electronic components. [2] The procedure enables bonding temperatures from 1000 °C down to room temperature. [1] Adhesive bonding has the advantage of relatively low bonding temperature as well as the absence of electric voltage and current.
Excellent resistance to solvents and chemicals. Low application temperature, suitable for heat-sensitive substrates. Heat-resistant after curing, with service temperatures generally from −30 °C (−22 °F) to 150 °C (302 °F). Ink-solvent resistant. Often used in bookbinding, automotive, aerospace, filter and plastic bag applications.
Cycloaliphatic epoxy resins are characterized by their low viscosity, allowing for the incorporation of substantial amounts of fillers. When the proportion of novolac epoxy resin is maintained below 10 weight percent, there is an observable increase in the warping of the semiconductor packaging structure, which may lead to delamination and ...
Liquid optically-clear adhesive (LOCA) is liquid-based bonding technology used in touch panels and display devices to bind the cover lens, plastic, or other optical materials to the main sensor unit or each other. These adhesives improve optical characteristics and durability.
Curing is a chemical process employed in polymer chemistry and process engineering that produces the toughening or hardening of a polymer material by cross-linking of polymer chains. [1] Even if it is strongly associated with the production of thermosetting polymers , the term "curing" can be used for all the processes where a solid product is ...