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Laurell Technologies WS-400 spin coater used to apply photoresist to the surface of a silicon wafer. Spin coating is a procedure used to deposit uniform thin films onto flat substrates. Usually a small amount of coating material in liquid form is applied on the center of the substrate, which is either spinning at low speed or not spinning at all.
The angular velocity and time relate to the spin coater and how fast it is spinning and for how long. A common issue in spin coating is a "beading" up of solvent at the edge of the silicon wafer. A process known as backside washing is most commonly used to spin this bead off of the wafer.
The wafer is covered with photoresist liquid by spin coating. Thus, the top layer of resist is quickly ejected from the wafer's edge while the bottom layer still creeps slowly radially along the wafer. In this way, any 'bump' or 'ridge' of resist is removed, leaving a very flat layer.
Slot-die coating is a non-contact coating method, in which the slot-die is typically held over the substrate at a height several times higher than the target wet film thickness. [23] The coating fluid transfers from the slot-die to the substrate via a fluid bridge that spans the air gap between the slot-die lips and substrate surface.
Spin casting, also known as centrifugal rubber mold casting (CRMC), is a method of utilizing inertia to produce castings from a rubber mold. Typically, a disc-shaped mold is spun along its central axis at a set speed.
Dow Inc. is a leading materials science company formed by the merger of Dow and DuPont in 2017 and subsequent spin in 2019. The company is organized into three principal divisions:
For the first two hours of his treatment, the machine hummed along like a washing machine on a perpetual spin cycle. Thomas swaddled himself in layers of blankets and settled into his seat. Then a ...
Dip coating is similar to spin coating in that a liquid precursor or sol-gel precursor is deposited on a substrate, but in this case the substrate is completely submerged in the solution and then withdrawn under controlled conditions. By controlling the withdrawal speed, the evaporation conditions (principally the humidity, temperature) and the ...