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If the MOSFET is an n-channel or nMOS FET, then the source and drain are n+ regions and the body is a p region. If the MOSFET is a p-channel or pMOS FET, then the source and drain are p+ regions and the body is a n region. The source is so named because it is the source of the charge carriers (electrons for n-channel, holes for p-channel) that ...
MOSFET (PMOS and NMOS) demonstrations Date Channel length Oxide thickness [1] MOSFET logic Researcher(s) Organization Ref; June 1960: 20,000 nm: 100 nm: PMOS: Mohamed M. Atalla, Dawon Kahng: Bell Telephone Laboratories [2] [3] NMOS: 10,000 nm: 100 nm: PMOS Mohamed M. Atalla, Dawon Kahng: Bell Telephone Laboratories [4] NMOS May 1965: 8,000 nm ...
In semiconductor electronics, Dennard scaling, also known as MOSFET scaling, is a scaling law which states roughly that, as transistors get smaller, their power density stays constant, so that the power use stays in proportion with area; both voltage and current scale (downward) with length.
The codes given in the chart below usually tell the length and width of the components in tenths of millimeters or hundredths of inches. For example, a metric 2520 component is 2.5 mm by 2.0 mm which corresponds roughly to 0.10 inches by 0.08 inches (hence, imperial size is 1008).
A high voltage MOSFET requires a thick, low-doped layer, i.e., highly resistive, whereas a low-voltage transistor only requires a thin layer with a higher doping level, i.e., less resistive. As a result, R n is the main factor responsible for the resistance of high-voltage MOSFETs; R D is the equivalent of R S for the drain.
In most circuits, this means pulling an enhancement-mode MOSFET's gate voltage towards its drain voltage turns it on. In a depletion-mode MOSFET, the device is normally on at zero gate–source voltage. Such devices are used as load "resistors" in logic circuits (in depletion-load NMOS logic, for example).
The MOSFET (metal–oxide–semiconductor field-effect transistor) utilizes an insulator (typically SiO 2) between the gate and the body. This is by far the most common type of FET. The DGMOSFET (dual-gate MOSFET) or DGMOS, a MOSFET with two insulated gates. The IGBT (insulated-gate bipolar transistor) is a device for power control. It has a ...
Equivalent circuit of a power MOSFET, including the dynamic elements (capacitors, inductors), the parasitic resistors, the body diode. Date: 13 April 2006 (original upload date) Source: No machine-readable source provided. Own work assumed (based on copyright claims). Author: No machine-readable author provided.