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A die is a specialized machine tool used in manufacturing industries to cut and/or form material to a desired shape or profile. Stamping dies are used with a press, [1] as opposed to drawing dies (used in the manufacture of wire) and casting dies (used in molding) which are not.
Marking is essential for all equipment with an acquisition cost of over $5,000, equipment which is mission essential, controlled inventory, or serially-controlled. UID-marking is a set of data for assets that is globally unique and unambiguous. The technology used to mark an item is 2D Data Matrix ECC 200 Symbol.
Most dies are composed of silicon and used for integrated circuits. The process begins with the production of monocrystalline silicon ingots. These ingots are then sliced into disks with a diameter of up to 300 mm. [3] [4] Typical NPN transistor. Size of die is roughly 1 mm × 1 mm.
Direct part marking (DPM) is a process to permanently mark parts with product information including serial numbers, part numbers, date codes, and barcodes. This is done to allow the tracking of parts through the full life cycle. The interpretation of 'permanent' often depends on the context the part is used.
Laser bonding is a marking technique that uses lasers to bond an additive marking substance to a substrate.. First invented in the mid 1990s by Essilor International, this patented method [1] produces permanent marks on metal, glass, ceramic and plastic parts for a diverse range of industrial and artistic applications, ranging from aerospace and medical to the awards and engraving industries.
Dies are made of cast light alloys and the rubber pad is 1.5-2 times thicker than the component to be formed. For Marforming, single-action presses are equipped with die cushions and blank holders. The blank is held against the rubber pad by a blank holder, through which a punch is acting as in conventional deep drawing.