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A compound semiconductor is a semiconductor compound composed of chemical elements of at least two different species. These semiconductors form for example in periodic table groups 13–15 (old groups III–V), for example of elements from the Boron group (old group III, boron, aluminium, gallium, indium) and from group 15 (old group V, nitrogen, phosphorus, arsenic, antimony, bismuth).
Nanoelectronics holds the promise of making computer processors more powerful than are possible with conventional semiconductor fabrication techniques. A number of approaches are currently being researched, including new forms of nanolithography , as well as the use of nanomaterials such as nanowires or small molecules in place of traditional ...
This is a list of emerging technologies, which are in-development technical innovations that have significant potential in their applications. The criteria for this list is that the technology must: Exist in some way; purely hypothetical technologies cannot be considered emerging and should be covered in the list of hypothetical technologies ...
Next-generation lithography or NGL is a term used in integrated circuit manufacturing to describe the lithography technologies in development which are intended to replace current techniques. Driven by Moore's law in the semiconductor industries, the shrinking of the chip size and critical dimension continues.
Advanced packaging allows multiple devices, including electrical, mechanical, or semiconductor devices, to be merged and packaged as a single electronic device. Advanced packaging uses processes and techniques that are typically performed at semiconductor fabrication facilities , unlike traditional integrated circuit packaging, which does not.
For contributions to the design and fabrication of radiation-hardened integrated circuits, and advances in semiconductor device technology 1994: Robert Swartz: For contributions to the design of high-speed integrated circuits for optical communication systems. 1994: Richard Temkin
Intel Core i7 and Intel Core i5 processors based on Intel's Broadwell 14 nm technology was launched in January 2015. [118] AMD Ryzen processors based on AMD's Zen or Zen+ architectures and which uses 14 nm FinFET technology. [119]
The insulating material has traditionally been a form of SiO 2 or a silicate glass, but recently new low dielectric constant materials, also called low-κ dielectrics, are being used (such as silicon oxycarbide), typically providing dielectric constants around 2.7 (compared to 3.82 for SiO 2), although materials with constants as low as 2.2 are ...