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Commercial extruded aluminium heat sinks have a thermal resistance (heat sink to ambient air) ranging from 0.4 °C/W for a large sink meant for TO-3 devices, up to as high as 85 °C/W for a clip-on heat sink for a TO-92 small plastic case. [3]
Generally, forced convection heat sink thermal performance is improved by increasing the thermal conductivity of the heat sink materials, increasing the surface area (usually by adding extended surfaces, such as fins or foam metal) and by increasing the overall area heat transfer coefficient (usually by increase fluid velocity, such as adding ...
Thus, adding a fin to an object, increases the surface area and can sometimes be an economical solution to heat transfer problems. One-piece finned heat sinks are produced by extrusion, casting, skiving, or milling.
The only other IC with a heat sink is the RAMDAC (right from CPU). See also: Passive cooling Passive heatsink cooling involves attaching a block of machined or extruded metal to the part that needs cooling.
Standard heat pipes are constant conductance devices, where the heat pipe operating temperature is set by the source and sink temperatures, the thermal resistances from the source to the heat pipe, and the thermal resistances from the heat pipe to the sink. In these heat pipes, the temperature drops linearly as the power or condenser ...
Structure of poly-oxydiphenylene-pyromellitimide Kapton insulating pads for mounting electronic parts on a heat sink. Kapton is a polyimide film used in flexible printed circuits (flexible electronics) and space blankets, which are used on spacecraft, satellites, and various space instruments.