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  2. J-B Weld - Wikipedia

    en.wikipedia.org/wiki/J-B_Weld

    The mixture sets in 4-6 hours and fully cures in up to 15 hours. It can be used as an adhesive, laminate, plug, filler, sealant, or electrical insulator and can be drilled, ground, tapped, machined, sanded, and painted when cured. J-B Kwik is a faster-curing two-part epoxy with medium-temperature resistance up to 300 °F (149 °C).

  3. Fusion bonded epoxy coating - Wikipedia

    en.wikipedia.org/wiki/Fusion_bonded_epoxy_coating

    The second most important part of FBE coatings is the curing agent or hardener. Curing agents react either with the epoxy ring or with the hydroxyl groups, along the epoxy molecular chain. Various types of curing agents, used in FBE manufacture, include dicyandiamide, aromatic amines, aliphatic diamines and organic acid anhydrides. [6]

  4. Epoxy putty - Wikipedia

    en.wikipedia.org/wiki/Epoxy_putty

    The left component is Epoxy Base Resin and the right one is Epoxy Hardener. Both are to be mixed thoroughly in equal quantity to get epoxy putty. Epoxy putty refers to a group of room-temperature-hardening substances used as space-filling adhesives. Exact compositions vary according to manufacturer and application.

  5. Spackling paste - Wikipedia

    en.wikipedia.org/wiki/Spackling_paste

    Spackling paste is comparable and contrastable with joint compound as both look similar and serve the similar purpose of filling in low spots in walls and ceilings. [3] The chief differences are that spackling paste typically dries faster, shrinks less during drying, and is meant for smaller repairs, and not for a whole room or house.

  6. Adhesive bonding - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding

    After evaporation of the solvent, a solid compound is formed. Chemical bonds are also important in certain adhesive / substrate combinations, for example when bonding glass using silicone adhesives, wood using polyurethane adhesives and aluminium using epoxy adhesives. Chemical bonding leads to significantly higher adhesion than physical bonding.

  7. Potting (electronics) - Wikipedia

    en.wikipedia.org/wiki/Potting_(electronics)

    A small transformer potted in epoxy. The surface visible on the right is formed by the potting compound that has been poured into the plastic box. In electronics, potting is the process of filling a complete electronic assembly with a solid or gelatinous compound.