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There are several types of gold plating used in the electronics industry: [3] Soft, pure gold plating is used in the semiconductor industry. The gold layer is easily soldered and wire bonded. Its Knoop hardness ranges between 60 and 85. The plating baths have to be kept free of contamination. Soft, pure gold is deposited from special electrolytes.
Gold hydroxide is used in medicine, porcelain making, gold plating, and daguerrotypes. Gold hydroxide deposited on suitable carriers can be used for preparation of gold catalysts. [citation needed] Gold hydroxide is a product of electrochemical corrosion of gold metalization subjected to moisture and positive electric potential; it is one of ...
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Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
In gold mining, KCN forms the water-soluble salt potassium gold cyanide (or gold potassium cyanide) and potassium hydroxide from gold metal in the presence of oxygen (usually from the surrounding air) and water: 4 Au + 8 KCN + O 2 + 2 H 2 O → 4 K[Au(CN) 2] + 4 KOH. A similar process uses NaCN to produce sodium gold cyanide (NaAu(CN 2)).
It is filled with a sample of the plating solution and an appropriate anode which is connected to a rectifier. The "work" is replaced with a Hull cell test panel that will be plated to show the "health" of the bath. The Hull cell is a trapezoidal container that holds 267 milliliters of a plating bath solution.