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Peltier cooling plates / ˈ p ɛ l t i. eɪ / take advantage of the Peltier effect to create a heat flux between the junction of two different conductors of electricity by applying an electric current. [9] This effect is commonly used for cooling electronic components and small instruments.
Thermoelectric cooling uses the Peltier effect to create a heat flux at the junction of two different types of materials. A Peltier cooler, heater, or thermoelectric heat pump is a solid-state active heat pump which transfers heat from one side of the device to the other, with consumption of electrical energy, depending on the direction of the current.
Reflowing as a rework technique, similar to the manufacturing process of reflow soldering, involves dismantling the equipment to remove the faulty circuit board, pre-heating the whole board in an oven, heating the non-functioning component further to melt the solder, then cooling, following a carefully determined thermal profile, and ...
The cooling effect of thermoelectric materials depends on the Peltier effect. [11] When an external current is applied to a circuit composed of n-type and p-type thermoelectric units, the current will drive carriers in the thermoelectric units to move from one side to the other.
Once a closed circuit is made up of more than one metal and there is a difference in temperature between junctions and points of transition from one metal to another, a current is produced as if generated by a difference of potential between the hot and cold junction.
A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).